[애플 코리아] IC Packaging Engineer 채용

외국계 IT기업

애플 코리아에서

IC Packaging Engineer를 모집 합니다.

Summary

Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for perfection to work towards an extraordinary result? We are looking for a talented and passionate IC Packaging Engineer. You will be responsible for IC packaging development and new product introduction for programs requiring SIP module packaging and substrate-based IC packaging. Looking for individuals who are innovative, creative, driven, and work well within a team.

 

Description

• Work with cross-functional teams and lead package integration and architecture efforts. 
• Work with 3rd party and OSATs to bring IC packaging solutions from concept to mass production. 
• Work to bring innovative packaging solutions from concept to mass production, including package, module and technology development.
• Conduct and approve packaging proposals, designs, schematics, process flows, risk assessments, technical specifications, reliability requirements, data collection, and analysis.

Minimum Qualifications

• Bachelors and 10+ years or relevant industry experience in Semiconductor Packaging Design, Process and New Product Introduction.
• Must have hands-on experience and expertise on IC packaging.

Preferred Qualifications

• Typically requires at least 5+ years of experience in Semiconductor Packaging Design, Process and New Product Introduction. Must have hands-on experience and expertise on IC packaging.
• Strong knowledge and experience in IC packaging, SIP Module packaging, single die packaging and heterogeneous package integration.
• Knowledge and experience package assembly process, materials, and equipment. Experience driving development of new enabling technology and roadmaps.
• Strong IC packaging materials background including characterization and failure analysis.
• Problem solver with strong engineering physics. Willing to tackle tough problems.
• Ability to work independently and work with multi-functional teams.
• Proven track record working with internal teams or vendors to execute introduction of new packaging and technology solutions.

[애플 코리아] IC Packaging Engineer 지원하러 바로가기 >>>

https://jobs.apple.com/ko-kr/details/200658289-3631/ic-packaging-engineer?team=HRDWR

IC Packaging Engineer - Apple 채용 정보 (KR)